Productbeschrijving
Technische specificatie
Operating Temperature: -40°C ~ +85°C
Non-Operating Temperature: -45°C ~ +85°C
SLC NAND Flash
IOPS:
4KB Random Read: up to 4,000
Sequential Read: up to 110MB/s
Sequential Write: up to 85MB/s
ATP benefits
• Pre-screened SLC (Single-Level-Cell) NAND flash memory
• Enhanced endurance by dynamic and static wear-leveling
• Hardware BCH ECC, corrects up to 8 bits in 512 byte data
• Supports S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology)
• Data integrity under power cycling
• In-house environment reliability testing, customized environmental testing available
• Application specific design, product performance tuning/customization
• In-house FAE team support, "our lab is your lab"
• System Level endurance/reliability testing
• Long term supported fixed/controlled BOM
• Optional SMART monitor software available
Extra informatie
Differences between Industrial grade SLC & commercial grade MLC products
Endurance
Not commonly known is issue of program/erase cycle lifetimes on NAND flash technology. The storage can only be erased and programmed to a finite number of times. Current SLC (Single Level Cell) technology is rated for at least 20 times more program/erase cycles than current MLC (Multi Level Cell) technology. In heavy erase/program applications, SLC is highly recommended to avoid pre-mature storage failure. Due to the fact that MLC is consumer/volume driven, within the next couple years MLC technology will continue to erode in program/erase cycle ability in order to have a lower cost/density. The new MLC die being used, starting 2010, is downrated from 10,000 cycles to 5,000 cycles.
Wide Temp IC Packaging Configurations
In order to meet the operating temperature range of -40C to 85C, only very particular flash IC and IC packaging configurations may be used. These configurations may allow for wider temp operation, but will also reflect the cost.
Production Level Burn-In
100% of all ATP Industrial Grade products go through multi-cycle, multi data pattern burn in testing. This is to screen against any possible early fallout occasionally seen in any semiconductor technology.
Supply Chain Stability and Fixed/Controlled BOM
MLC is above mentioned as the consumer/volume driven technology, with the main emphasis on cost/density. MLC flash generation changes and die revisions occur more frequently than SLC, with less time allowance for re-qualification With MLC, this makes it inherently difficult to support a single IC configuration over a long product life cycle as compared to SLC which typically only has a die revision change for the same density in several year time spans. With SLC technology, longer term support is possible allowing for a single BOM to be supported for several years.
Performance
Due to the lower complexity in managing SLC flash, the write performance for SLC at the IC level is typically twice as fast. With controller multiplexing this can be reduced, but this accounts for the main delta in read speed versus write speed in retail flash products today.
Technical Support
ATP also provides in-house testing (endurance, signal integrity and protocol compatibility) and custom firmware tuning or firmware setting adjustment. ATP also provides 100% failure analysis on all reported usage anomalies and inventory cross-shipments to minimize field or production down time.



